近5年期刊论文：

[1] J. L. Su, Z. X.Cai, Y. Mao, L. Chen, X. Y. Yu, Z. C. Yu, Q. Ma, S. Q. Huang, J.Zhang, J. W. You and T. J. Cui, “Multi-Dimensional Multiplexed Metasurface for MultifunctionalNear-Field Modulation by Physics-Driven Intelligent Design,” AdvancedScience (Accepted).

[2] L. Chen, J. W. You, X. W. Wu, Q. Xiao, Z. Gu,S. L. Qin, T. J. Peng, Q. Ma, Y. Q. Mao, J. N. Zhang and T. J.Cui, “Accurate Modeling of Time-Varying Lumped Elements in Space-TimeMetasurfaces,” IEEE Transactions on Antennas and Propagation (Earlyaccess).
[3] F.-F. Wang, K.-M. Li, Y.Mao and Q. H. Liu, "A Hybrid Born Iterative Method for Diagnosisof Planar Arrays with Amplitude-Only Far-Field Measurements," IEEEAntennas Wireless Propag. Lett., 23(2), pp. 548-552, 2024.
[4] Y. Mao, U.R. Patel, and E. Michielssen, “Wigner-Smith Time Delay Matrix forElectromagnetics: Guiding and Periodic Systems with Evanescent Modes,” IEEETrans. Antennas Propag., 71(5), pp. 4406-4416, 2023.
[5] Y. Mao, Y.Zhong, Q. Zhan, D. Wang, and Q. H. Liu, “A Simple Way of Applying the CalderónPreconditioner to a Finite-Element Boundary-Integral Method,” IEEE Trans.Antennas Propag., 71(6), pp. 5510-5515, 2023. 
[6] Y. Mao, Q.Zhan, Q. Sun, D. Wang, and Q. H. Liu, “Mesh-splitting Impedance TransitionBoundary Condition for Accurate Modeling of Thin Structures,” IEEE Trans.Antennas Propag., 71(5), pp. 4612-4617, 2023.
[7] Y. Mao, U.R. Patel, and E. Michielssen, “Wigner-Smith Time Delay Matrix forElectromagnetics: Systems with Material Dispersion and Losses,” IEEE Trans.Antennas Propag., 71(6), pp. 5266-5275, 2023. 
[8] L.-Y. Xiao, J.-N. Yi, Y.Mao, X.-Y. Qi, R. Hong, and Q. H. Liu, “A Novel Optical ProximityCorrection (OPC) System Based on Deep Learning Method for the ExtremeUltraviolet (EUV) Lithography,” Progress in Electromagnetics Research,176, pp. 95-108, 2023.
[9] U. R. Patel, Y. Mao,and E. Michielssen, “Wigner-Smith Time Delay Matrix for Acoustic Scattering:Theory and Phenomenology,” J. Acoust. Soc. Am., 153(5), pp. 2769, 2023.
[10] D. Wang, Y. Hu, Y. Fang, Y.Mao, and Q. H. Liu, "Fast VIE-DDM for 3-D ElectromagneticScattering of Complicated Anomalies in Layered Media Using Adaptive CrossApproximation," IEEE Trans. Geosci. Remote Sens., 61, pp. 1-9,2023.
[11] Y. Zhong, H. Wang, W.-F.Huang, Y. Mao, M. Yuan, L. Cui, and Q. H. Liu, "EfficientDomain Decomposed Simulations of Induction Well-Logging Tools in a DeviatedBorehole," IEEE Trans. Geosci. Remote Sens., 61, pp. 1-10, 2023.
[12] Y. Mao, Q.Zhan, D. Wang, R. Zhang, and Q. H. Liu, “Modeling Thin 3-D Material SurfacesUsing a Spectral-Element Spectral-Integral Method with the Surface CurrentBoundary Condition,” IEEE Trans. Antennas Propag., 70(3), pp. 2375-2380,2022.
[13] R. Zhang, Q. Sun, Y.Mao, L. Cui, Y. Jia, W.-F. Huang, M. Ahmadian, and Q. H. Liu,“Accelerating Hydraulic Fracture Imaging by Deep Transfer Learning,” IEEETrans. Antennas Propag., 70(7), pp. 6117-6121, 2022.
[14] D. Wang, J. Dai, Y. Fang,Y. Hu, R. Zhang, Y. Mao, and Q. H. Liu, “NMM Simulation ofElectromagnetic Waves in Cylindrical Geometries With an Extremely Thin VerticalLayer,” IEEE Trans. Geosci. Remote Sens., 60, pp. 1-10, 2022.
[15] Y. Mao, Q.Zhan, R. Zhang, D. Wang, W.-F. Huang, and Q. H. Liu, “Fast simulation ofelectromagnetic fields in doubly periodic structures with a deep fullyconvolutional network,” IEEE Trans. Antennas Propag., 69(5), pp.2921-2928, 2021.
[16] W. F. Huang, H. Wang, Y.Zhong, R. Zhang, D. Wang, Y. Mao, Y. Jia, and Q. H. Liu, “SurfaceIntegral Equations for Low-Frequency Simulation in Well Logging Applications”, IEEETrans. Antennas Propag., 69(7), pp. 3957-3965, 2021.
[17] Y. Mao, J.Niu, Q. Zhan, R. Zhang, W.-F. Huang, and Q. H. Liu, “Calderón preconditionedspectral-element spectral-integral method for doubly periodic structures inlayered media,” IEEE Trans. Antennas Propag., 68(7), pp. 5524-5533,2020.
[18] Q. Zhan, M. Zhuang, Y.Mao, and Q. H. Liu, “Unified Riemann Solution for Multi-physicsCoupling: Anisotropic Poroelastic/Elastic/Fluid Interfaces,” Journal ofComputational Physics, 402, p.108961, 2020.

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常年招收1~2位博士生，3~4位硕士生。欢迎本科生参与SRTP和本科毕设。可推荐集成电路EDA就业机会和国外一流院校访问机会。