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吴旭 博士,东南大学移动通信全国重点实验室副教授。
比利时鲁汶大学电子系毕业,预博期间师从泰斗级集成电路设计大师Willy Sansen教授,博士期间师从IEEE国际固态电路领域50及60年十大杰出贡献者M. Steyaert教授。在集成电路、传感器领域多个国际著名期刊及会议上发表30余篇论文,包含IEEE 固态电路期刊(IEEE JSSC)、亚洲固态电路会议、ELECTRONIC LETTERS 等。2011-2017年间,在比利时CMOSIS公司担任高级设计工程师,期间公司发布了莱卡相机的首款CMOS图像传感器,个人及所带团队设计并完成多款模拟及混合信号芯片的设计并成功量产。归国后,受聘于东南大学信息科学与工程学院,作为国家重点研发计划课题负责人,从事毫米波相控阵收发系统芯片、毫米波射频芯片、模拟及混合信号集成电路、大规模太赫兹成像探测芯片等方面研究,并深度参与了5G毫米波芯片国家重大专项课题及多个高水平横纵向项目。
依托移动通信全国重点实验室和紫金山实验室平台,在尤肖虎院士的指导下,我们通信用集成电路团队蓬勃发展,硕果累累,相关成果达到国际前沿水平。仅2023年起至今,团队已发表ISSCC国际固态电路会议1篇,ESSCIRC欧洲固态电路会议1篇,ASSCC亚洲固态电路会议1篇,7篇文章已被射频集成电路领域重要会议IMS和RFIC接收(其中两篇入选top 50)。此外,还在IEEE期刊及其它重要会议上发表论文20余篇。团队充满朝气和活力,流片机会多,同学毕业出路好。欢迎立志于集成电路创新研究的优秀同学加入,开创未来无限可能!
依托移动通信全国重点实验室和紫金山实验室平台,在尤肖虎院士的指导下,我们通信用集成电路团队蓬勃发展,硕果累累,相关成果达到国际前沿水平。仅2023年起至今,团队已发表ISSCC国际固态电路会议1篇,ESSCIRC欧洲固态电路会议1篇,ASSCC亚洲固态电路会议1篇,7篇文章已被射频集成电路领域重要会议IMS和RFIC接收(其中两篇入选top 50)。此外,还在IEEE期刊及其它重要会议上发表论文20余篇。团队充满朝气和活力,流片机会多,同学毕业出路好。欢迎立志于集成电路创新研究的优秀同学加入,开创未来无限可能!
作为国家重点研发计划课题负责人,从事毫米波相控阵收发系统芯片、毫米波射频芯片、模拟及混合信号集成电路、大规模太赫兹成像探测芯片等方面研究,并深度参与了5G毫米波芯片国家重大专项课题及多个高水平横纵向项目。
近期部分论文成果:
(1)X. Wang, Xu. Ma, Y. Fu, Y. Zhou, A. Li, S. Yang, X. Wu,D. Wang, L. Li, X. You, “An 11GHz 2nd-order DPD FMCW ChirpGenerator with 0.051% rms Frequency Error under a 2.3GHz Chirp Bandwidth,2.3GHz/μs Slope, and 50ns Idle Time in 65nm CMOS”, ISSCC, 2024. Feb.
(2) X. Chen, D.Cheng, X. Ma, J. Feng, Q. Chen, X. Wu, X. Fan, and L. Li, “A 60-GHz Phase-Invariant Variable Gain LNA with T/RSwitch and Gain Interpolation Techniques in 65-nm CMOS”, in IEEE Microwave andWireless Technology Letters, doi: 10.1109/LMWT.2024.3371506.
(3) X. Chen, X. Niu, X. Wang, H. Duan, J. Feng, L. Lu, L. He,Q. Chen, D. Cheng, L. Luo, X.Wu, J. Si, X. Ma, X. Fan, L. Li, “A 37-43.5-GHz Fully-Integrated16-Element Phased-Array Transceiver with 64-QAM 7.2-Gb/s Data Rates Supporting Dual-PolarizedMIMO”, in IEEE Microwave and Wireless Technology Letters, doi: 10.1109/LMWT.2024.3375888.
(4) Y. Wang, H.Duan, L. He, D. Cheng, X. Wu, D. Wang, P. Reynaert, L. Li "A 39-GHzHigh Image-Rejection Up-Conversion Mixer in 65-nm CMOS for 5GCommunication," in IEEE Transactions on Circuits and Systems II: ExpressBriefs 70: 491-495, 2023.
(5) Y. Wang, H. Duan, L. He, X. Wu, D. Wang, L. Li,"Design of 39-GHz Up- and Down-Conversion Mixers for 5G mmWave TDDApplications", Journal of Electromagnetic Engineering and Science, vol.23,no.2, pp.101, 2023.
(6)Y. Liang, Q. Chen, X. Zhang, X. Wu, X. Fan and L.Li, "A Compact 240 GHz Differential Fundamental Oscillator with-94.2dBc/Hz Phase Noise and 5.4% DC-to-RF Efficiency in 22nm FDSOI,"ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),Lisbon, Portugal, pp. 133-136, 2023.
(7)Y. Liang, Q. Chen, X. Wu, X. Fan and L. Li, "A226 GHz Coupled Harmonic VCO with 9.34% Tuning Range Utilizing Three-CoilTransformer with Switched Inductor in 65nm CMOS," 2023 IEEE AsianSolid-State Circuits Conference (A-SSCC), Haikou, China, pp. 1-3, 2023.
(8)L. Lu, X. Ma, J. Feng, Q. Chen, D. Cheng, X. Fan, X. Wu and L. Li, "A Ka-Band Frequency Doubler With a Broadband Matching Schemefor Efficiency Optimization," in IEEE Microwave and Wireless TechnologyLetters, doi: 10.1109/LMWT.2024.3356260, 2024.
(9)H. Duan, Q. Chen, X. Wang, D. Cheng, X. Chen, X. Wu,D. Wang, L. Li, "A Ku-Band Transmitter Front-End in 65-nm CMOS with>45-dBc Image-Rejection Ratio and >43-dBc LOFT Suppression", IEICEElectronics Express, 2023.
(10)H. Xia, Z. Liu, H. Liu, T. Zhang, F. Wang, X. Hu, X.Wu, L. Li and Z. Wang, “A Cost-Effective Wideband Dual-Polarized L-ShapedProbe-Fed Phased Array Antenna for 60-GHz AiP Applications,” in IEEETransactions on Components, Packaging and Manufacturing Technology, vol. 13,no. 11, pp. 1790-1803, Nov. 2023.
(11) T. Zhang, Z.Zhu, C. Xia, H. Xia, Z. Liu, X. Wu, L. Li, T. Cui, "A MiniaturizedVivaldi Antenna in Fan-out Wafer-Level Package for 5G Millimeter WaveApplications," in IEEE Antennas and Wireless Propagation Letters, doi:10.1109/LAWP.2024.3374365.
(12)T. Zhang, Z. Zhu, H. Xia, X. Wu, L. Li and T. Cui,"60-GHz Scalable LTCC Phased Array With Compact Symmetric Hybrid FeedingNetwork for Antenna-in-Package Application," in IEEE Transactions onComponents, Packaging and Manufacturing Technology, vol. 13, no. 10, pp.1694-1702, Oct. 2023, doi: 10.1109/TCPMT.2023.3315779.
(13) Z. Liu, H.Xia, H. Liu, T. Zhang, X. Wu and L. Li, "Compact Scalable GapWaveguide Phased Array Horn Antenna with Efficient Decoupling Network," inIEEE Transactions on Antennas and Propagation, doi: 10.1109/TAP.2023.3347878.
(14) X. Chen, X.Niu, X. Wang, H. Duan, J. Feng, L. Lu, L. He, Q. Chen, D. Cheng, L. Luo, X. Wu, J. Si, X. Ma, X.Fan, L. Li,“A 37-43.5-GHz Fully-Integrated 16-ElementPhased-Array Transceiver with 64-QAM 7.2-Gb/s Data Rates SupportingDual-Polarized MIMO”,International Microwave Symposium(IMS)2024, June 16-21,Accepted.
(15) H. Duan, Q. Chen, X. Wu, D. Wang, L. Li, X. You,“A Multi-Band and High-IRR Down-Conversion Mixer for 5G NR FR2 UsingCompact Transformer-Based Mutual-Image-Rejection Filter”,Radio Frequency Integrated Circuits Symposium (RFIC) 2024 June16-18, Accepted.
(16) Q. Chen, J.Lu, X. Jiang, X. Yang, Y. Liang, Y. Hu, Y. Wang, J. Liu, L. Lu, D. Cheng, J.Feng, L. Luo, L. He, X. Wu, L. Li, “A Frequency ReconfigurablePhased-Array Front-End with Enhanced Image-Rejection and High-Resolution LOPhase Shifter for 5G FR2 n258/n260/n261 Bands”, Radio Frequency IntegratedCircuits Symposium (RFIC) 2024 June 16-18, Accepted.
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